PCB Design & SI/PI/EMI Review
Schematic & PCB Design, SI/PI/EMI Review, and DFM
You will get advanced multilayer PCB design with Design for Manufacturing (DFM), SI/PI and EMI review
Price & Scope
Standard
€2,500
4–6 layer PCB, pin density >0.6, 600 pins, 150 comps, 250 nets, DFM/EMI aware layout with basic thermal and SI checks
- 14 days delivery
- 1 revision
- Model
- Source Files
Premium
€4,000
4-16 layer PCB, HDI, BGAs, pin density <0.6, 1,000 pins, 300 comps, 500 nets, vias in pad, blind/buried, SI/PI/EMI analysis, ext doc
- 21 days delivery
- 2 revisions
- Model
- Source Files
Field of Expertise
Development Tools
File Format
Project summary
We will design or refine a complex multilayer PCB with a strong focus on signal integrity, EMI/EMC, thermal performance, and manufacturability. This covers controllers, drivers, RF/microwave boards, radio modules, power electronics, and mixed‑signal designs from 4–8 layers up to advanced 32‑layer stacks. We work with fine‑pitch SMD (01005, 0201 and above), high‑density BGAs, HDI, rigid and rigid‑flex boards, and metal‑core or heavy‑copper PCBs for high‑current and high‑power applications.
What’s included
The stackup is engineered around IPC Class 2+/3 requirements with trace widths down to 4-6 mil, annular rings to 1-2 mil, trace spacing and clearances from 6-10 mil, symmetric cores and at least two prepreg plies, dielectric thicknesses ≥90 μm where practical, and materials with Tg above 170°C, thermal conductivity above 0.4 W/m·K, low CTE, CAF‑resistant and RoHS‑compliant. Power and ground planes are placed to support clean return paths and reduced EMI, with signal layers referenced to nearby ground planes for better SI.
Standard and Premium tier (high complexity)
Standard projects include full schematic and layout in KiCad, stackup definition, routing of critical power and signal nets, DFM‑oriented clearances and annular rings, and basic checks for thermal hotspots, EMI risks, and microcontroller signal quality. Premium projects extend this with deeper impedance and crosstalk control, HDI features, more advanced SI/thermal/EMI analysis, and richer manufacturing and assembly documentation.
What we need before starting
● Provide block diagram and functional description
● Specify MCU/SoC family and key interfaces
● Share target PCB manufacturer and design rules
● Define board size limits and mechanical constraints
● List power levels, frequencies, and key EMI/thermal risks
● Provide reference schematics and datasheets
What’s not included
● Firmware development and hardware bring‑up (separate service)
● On‑site testing, certification, or lab measurements
● Full SI/PI for ultra‑high‑speed (PCIe, DDR, multi‑GHz)
● Complete mechanical enclosure design in this project (separate offer)
● Turnkey manufacturing, assembly, and component sourcing (separate offers)
Steps for completing your project
1. Requirements and architecture
Clarify the board purpose, interfaces, microcontroller/SoC family, target layer count, mechanical limits, environment, and manufacturer design rules; define stackup constraints and key risks (SI, EMI, thermal).
2. Concept and schematic
Create or refine the block diagram and schematic in KiCad, including power distribution, decoupling, protection, and interfaces; run basic simulations (SPICE or KiCad‑integrated) for critical analog or power stages where relevant.
3. Component placement and DFM review
Select or verify footprints, place components with attention to flows, return paths, thermal paths, and mechanical constraints; perform a DFM pass for assembly, stencil, rework access, and test‑point strategy; draft the BOM.
4. PCB layout and stackup /standard
Standard: route all nets on a 4–8 layer board, define copper thickness (i.g, 2–3 oz for high‑current nets, 1 oz planes), masks, silkscreen, basic via strategy, keeping power/ground planes adjacent and signal layers referenced to ground for SI/EMI.
4. PCB layout and stackup /premium
Premium: implement denser/HDI routing, controlled‑impedance structures, rigid‑flex zones, and advanced copper balancing.
5. Analysis, review and refinement
Standard: run basic checks of power traces, thermal spreading on copper, simple EMI risk review, and microcontroller signal quality for main interfaces.
5. Analysis, review and refinement
Premium: add impedance and crosstalk checks, more detailed SI/thermal/EMI review, and refinements based on these results.
6. Manufacturing package and handover
Prepare Gerber and Drill files, layer stack documentation, solder mask and stencil data, silkscreen, fabrication notes, and, in Premium, detailed assembly drawings, pick‑and‑place, test‑point and net lists for electrical inspection.
We collaborate under Furtherium, Inc. (US, Canada) and Furtherium UG (EU/UK) with transparent project-based contracts. Most projects take 1-2 weeks with dedicated communication via our private AWS-hosted community or your corporate systems (Slack, Jira, Notion, Asana, Trello, GitHub, etc.). Typical project cost: €4-8k. Hourly rate: €80/hr.
A deal is considered concluded under the terms of the offer once the contractor confirms the client’s request and the client accepts it through payment. Written communications between the parties form an integral part of the agreement and may serve as valid evidence in case of dispute resolution.
Where additional terms are required, a separate contract and detailed specifications for a series of projects may be agreed upon. If necessary, a separate Non-Disclosure Agreement (NDA) may also be executed; the contractor’s total liability is limited to the total value of the client’s paid orders.
Offer prices are valid as of the date of publication and may be updated by the contractor at any time prior to order confirmation and client acceptance.
All quoted prices are exclusive of VAT. For clients based in Germany, German VAT (MwSt/USt 19%) will be added to all invoices (Down Payment Invoice, Final Settlement, Outstanding Balance Invoice).
For clients based in the EU (excluding Germany), business customers who provide a valid VAT ID will be invoiced without VAT under the reverse-charge mechanism, and VAT will be self-assessed by the customer; if no valid VAT ID is provided, German VAT will be added.
For clients in the United Kingdom, local VAT rules apply depending on the place of supply and the customer’s VAT status.
For clients in the United States and Canada, services are provided by Furtherium, Inc. (California, USA). As our services are generally classified as remote consulting and digital services, they are not usually subject to California sales tax; however, sales tax may be charged where required by applicable US state or Canadian provincial law, for example if taxable software or physical deliverables are supplied or if local economic nexus thresholds are exceeded.
Frequently asked questions
Complex multilayer boards from 4–8 layers up to 32 layers, including controllers, RF/microwave and radio modules, power and driver boards, rigid and rigid‑flex designs, and heavy‑copper or metal‑core PCBs for high‑current applications.
We target IPC Class 2+/3 with fine features: trace widths down to about 0.1 mm, clearances from about 0.15 mm, symmetric stackups with multiple prepreg plies, and high‑Tg, CAF‑resistant, RoHS‑compliant materials appropriate for demanding environments.
Yes; Premium covers higher layer counts, HDI features, rigid‑flex sections, and copper thickness up to 2–3 oz on high‑current nets, with attention to thermal spreading and mechanical robustness; feasibility is confirmed against your manufacturer’s capabilities.
Standard includes basic thermal checks, EMI risk review, and simple signal quality checks for microcontroller interfaces. Premium adds more detailed impedance and crosstalk control, deeper SI/thermal/EMI review, and attention to HDI and dense routing constraints.
For advanced projects we may use SIwave for power and signal integrity and impedance/PDN, HFSS or HFSS 3D Layout for RF and high‑frequency structures, Icepak for CFD‑based PCB and enclosure thermal analysis, and Mechanical (often with Sherlock/SpaceClaim) for thermo‑mechanical stress, vibration and fatigue of the board and solder joints, especially in harsh environments.
Premium can optionally include coupling to Ansys SIwave, HFSS, Icepak and Mechanical for deeper SI/PI, RF, thermal and mechanical analysis of the PCB; this is proposed only when the board complexity, reliability targets and budget justify it, and the exact simulations are agreed upfront for your specific design.
This project focuses on design and DFM/EMI review. Fast in‑house prototyping in Munich with specific materials (Isola, Rogers) and component sourcing can be offered as a separate follow‑up project once the design is finalized.
We can prototype boards in‑house in Munich without 2+ week wait times, using high‑performance Isola and Rogers materials and sourcing components from Mouser, Digi‑Key, Farnell (Avnet), Rutronik, Bürklin and Arrow. You get tight quality control by the same engineer who designed the board, direct feedback on manufacturability, and pricing that is competitive with fast Chinese or Dutch services once you factor in shipping, customs and iteration time.
● Primary: precise written communication (messages, e‑mail, or your task/bug-tracker like Jira / Asana / Notion / Trello / GitHub).
● Chat and Calls: optional, scheduled only when needed for alignment or complex decisions.
